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MS:He Wei

published: 2015-11-10 15:16:58       hits: 

name : He Wei Sex: Male phone: 0086-28-83203218
email: heweiz@uestc.edu.cn office-address: Room 304,Building  of School of Microelectronics and Solid-State Electronics
PH.D  Supervisor: Yes Master Supervisor: Yes
major: Applied Chemistry
research interst: Printed Circuit Technology, Printed electronics as well as Applied Electrochemistry and Electronic Chemicals
Biography: 2001.11 up to now Professor, Director of Department of Applied Chemistry, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China
2000.11-2001.11 Visiting Professor in Department of Chemistry, University of Florence, Italy
2000.11- 1999.7  Professor, Director of Department of Applied Chemistry, School of Microelectronics and Solid-State Electronics, University of Electronic Science and Technology of China
1999.7 – 1992.9 Vice Professor of Department of Applied Chemistry, University of Electronic Science and Technology of China
1990.9- 1992.9 Visiting Scholar in Department of Chemistry, University of Florence, Italy
1987.5-1992.9 Teacher of Department of Applied Chemistry, University of Electronic Science and Technology of China
Education experience: M.S., Applied Chemistry
Chongqing University, P R China, 1987
1990.9- 1992.9 Visiting Scholar in Department of Chemistry, University of Florence, Italy
Selected Publications: 1、Zhihua Tao, Wei He,Shouxu Wang,Xuemei He,Cheng Jiao, and Dingjun Xiao. Synergistic Effect of Different Additives on Microvia Filling in an Acidic Copper Plating Solution. Journal of The E lectrochemical Society, 163 (8) D379-D384 (2016)12
2、Jianhui Lin , Chong Wang  , Shouxu Wang , Yuanming Chen, Wei He ,  Dingjun Xiao.Initiation electroless nickel plating by atomic hydrogen for PCB final finishing. Chemical Engineering Journal 306 (2016) 117–123
3、Linxian Ji, Shouxu Wang, Chong Wang, Guoqin Chen, Yuanming Chen, Wei He, Tan Ze. Improved uniformity of conformal through-Hole copper electrodeposition by revision of plating cell configuration[J]. Journal of The Electrochemical Society, 2015, 162(12): D575-D583
4、Yuanming Chen, Wei He, Xianming Chen, Chong Wang, Zhihua Tao,Shouxu Wang, Guoyun Zhou, Mohamed Moshrefi-Torbatic. Plating Uniformity of Bottom-up Copper Pillars and Patterns for IC Substrates with Additive-assisted Electrodeposition .Electrochimica Acta,120,pp293-310,2014
Awards:
1.The Second Award of Science and Technology Progress (2014) by Chinese Government
- The Award is given annually by Chinese Government for outstanding Contribution to Science and Technology Progress. The award entitled “High density interconnect hybrid integrated printed circuit key technology and industrialization”.
2. The First Award of Science and Technology Progress (2011) by Chinese Education Ministry
- The Award is given annually by Chinese Education Ministry for outstanding Contribution to Science and Technology Progress. The award entitled “Key Technology Research for High Density Interconnect PCB and its Application”.
Books: • H.W. Zhang, W.He  “Principles and Technology for Modern printed circuit”, Machinery Industry Press (2010), ISBN 978-7-111-28835-0
• W. He, “Design of Optimization Experiments and Data Analysis”, Press of  Chemical Engineering (2012),ISBN 978-7-122-13177-5