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ESE:YONG XIANG

published: 2015-12-09 23:07:35       hits: 

name : YONG XIANG Gender: MALE phone: 13980081938
email: xiang@uestc.edu.cn office-address: No. 2006, Xi Yuan Avenue, West High-tech Zone, Chengdu, Sichuan, 611731, P.R. China
major:  Electrical Engineering;Materials science and engineering
research interst includes the development of materials genome technologies, particularly high throughput combinatorial materials experimental tools, with applications to accelerating materials R&D, such as
• Solid state lithium ion batteries, particularly the gel polymer electrolyte based batteries with high capacity and safety
• Low cost thin film solar cells, particularly the high efficiency compound semiconductor thin film solar cells
• Power electronics, such as the insulated gate bipolar transistors (IGBT)
• Multi-functional smart coatings, such as the self cleaning, self healing, and electrochromic coatings
• Printed electronics, with applications to flexible electronics, batteries, and solar cells
 
Biography EDUCATION
MS & PhD in Materials Science, HARVARD UNIVERSITY, Cambridge, MA, USA 2001 & 2005
BS in Mechanical Engineering, UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA, Anhui, China 2000
PROFESSIONAL AND RESEARCH
UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA, Chengdu, Sichuan, China 2009 – Present
Professor, Associate Dean, School of Energy Science and Engineering (2011 – Present)
• Responsible for graduate and undergraduate programs for the School
Professor, Assistant Dean, School of Microelectronics and Solid-State Electronics (2009 – 2011)
• Assisted the Dean with R&D programs for the School
Associate Director, State Key Lab of Electronic Thin Films and Integrated Devices, Zhuhai Branch (2009 – Present)
• Coordinated industrial collaborations for the Lab in Guangdong Province
Teaching Schedule  
SELECTED PUBLICATIONS 1. Gang Wu, Jinliang An, Dawei Sun, Xiuzhi Tang, Yong Xiang* and Jinglei Yang*, Robust microcapsules with polyurea/silica hybrid shell for one-part self-healing anticorrosion coatings, J. Mater. Chem. A, DOI: 10.1039/C4TA01312C, (2014)
2. H.P. Zhou, Z. Zuo, S. Xu, Y. Xiang*, Inductively coupled hydrogen plasma processing of AZO thin films for heterojunction solar cell applications, Journal of Alloys and Compounds, DOI:10.1016/j.jallcom.2014.04.216
3. Jianfei Zhang, Shu Zhang*, Haitao Zhang,Yange Zhang, Zhi Zheng, Yong Xiang*, Activated selenium for promoted formation of metal selenide nanocrystals in solvothermal synthesis, Materials Letters, 122, 306–308, (2014)
4. Haitao Zhang, Meng Xie, Shu Zhang*, Yong Xiang*, Fabrication of highly crystallized Cu2SnS3 thin films through sulfurization of Sn-rich metallic precursors, Journal of Alloys and Compounds, 602, 199–203, (2014)
5. YongXiang*, Xiaokun Zhang, ShuZhang*, Insight into the mechanism of Sb promoted Cu(In,Ga)Se2 formation, Journal of Solid State Chemistry, 204, 278–282, (2013)
6. Jun Xu, Yibing Li, Yong Xiang* and Xi Chen*, A super energy mitigation nanostructure at high impact speed based on buckyball system, PLOS ONE, 8(5), e64697, (2013)
7. Jun Xu, Yueting Sun, Binglei Wang, Yibing Li, Yong Xiang∗, Xi Chen∗, Molecular dynamics simulation of impact response of buckyballs, Mechanics Research Communications, 49, 8-12, (2013)
8. Shu Zhang, Lu Wu, Ruoyu Yue, Zongkai Yan, Haoran Zhan, Yong Xiang*, Effects of Sb-doping on the grain growth of Cu(In, Ga)Se2 thin films fabricated by means of single-target sputtering, Thin Solid Films, 527, 137–140, (2013)
9. Huimin Jia, Weiwei He, Yan Lei, Xuewu Chen, Yong Xiang, Shu Zhang, Woon Ming Lau and Zhi Zheng*,  Controllable fabrication of ternary ZnIn2S4 nanosheet array film for bulk heterojunction solar cellst, RSC Adv., 3, 8909–8914, (2013)
10. H. Zhang, S.W. Gn, J. An, Y. Xiang, J.L. Yang, Impact Behaviour of GLAREs with MWCNT Modified Epoxy Resins, Experimental Mechanics, (2013)
11. Jun Xu, Yibing Li, Yong Xiang* and Xi Chen*, Energy absorption ability of buckyball C720 at low impact speed: a numerical study based on molecular dynamics, Nanoscale Research Letters, 8, 54, (2013)
12. Y. Lin, Y. Xiang, T.Y. Tsui, and J.J. Vlassak, "PECVD low-permittivity organosilicate glass coatings: Adhesion, fracture and mechanical properties", Acta. Mater., 56(17), 4932-4943 (2008).
13. M. Zhao, Y. Xiang, G. Xu, N. Ogasawara, N. Chiba, and X. Chen: "Thin film mechanical property determination from the loading curve of nanoindentation", Thin Solid Films, 516, 7571-7580 (2008).
14. Y. Xiang, J. McKinnell, and J.J. Vlassak: "Measuring the fracture toughness of ultra-thin films with application to AlTa coatings", Int. J. Fracture, 144(3),173-179 (2007).
15. M. Zhao, X. Chen, Y. Xiang, J.J. Vlassak, D. Lee, N. Ogasawara, N. Chiba, and Y. Gan: "Measuring elastoplastic properties of thin films on an elastic substrate using sharp indentation", Acta. Mater., 55, 6260-6274 (2007).
16. Y. Xiang, J.J. Vlassak: "Bauschinger and size effects in thin-film plasticity", Acta Mater., 54 (10), 5449-5460 (2006).
17. Y. Xiang, X. Chen, T.Y. Tsui, J.-I. Jang, and J.J. Vlassak, "Mechanical properties of porous and fully dense low-k dielectric thin films by nanoindentation and plane-strain bulge test", J. Mater. Res. 21 (2), 396-395 (2006).
18. X. Chen, Y. Xiang, and J.J. Vlassak, "A novel technique of measuring the mechanical properties of porous materials by nanoindentation ", J. Mater. Res. 21 (3), 715-724 (2006).
19. L. Nicola, Y. Xiang, J.J. Vlassak, E. Van der Giessen, and A. Needleman, "Plastic deformation of freestanding thin films: experiments and modeling", J. Mech. Phys. Solids, 54 (10), 2089-2110 (2005).
20. Y. Xiang, T. Li, J.J. Vlassak, and Z. Suo, "High ductility of a metal film adherent on a polymer substrate", Appl. Phys. Lett. 87 (16), 161910 (2005).
21. Y. Xiang, T.Y. Tsui, and J.J. Vlassak, "The mechanical properties of freestanding electroplated Cu thin films", J. Mater. Res., 21 (6), 1607-1618 (2005).
22. Y. Xiang and J.J. Vlassak, "Bauschinger effect in thin metal films", Scripta Mater. 53 (2), 177-182 (2005).
23. Y. Xiang, X. Chen, and J.J. Vlassak, "The plane-strain bulge test for thin films", J. Mater. Res. 20 (9), 2360-2370 (2005).
24. Y. Xiang, T.Y. Tsui, J.J. Vlassak, and Andrew J. McKerrow, "Measuring the elastic modulus and ultimate strength of low-k dielectric materials by means of the bulge test", in Proc. Int. Interconnect Tech. Conf., edited by IEEE (IEEE, Piscataway, NJ, USA, 2004), p.133.
25. Y. Xiang, J.J. Vlassak, M.T. Perez-Prado, T.Y. Tsui, A.J. McKerrow, "The effects of passivation layer and film thickness on the mechanical behavior of freestanding electroplated Cu thin films with constant microstructure", in Thin Films - Stresses and Mechanical Properties X, edited by S.G. Corcoran et al. (Mater. Res. Soc. Sym. Proc. 795, Warrendale, PA, 2004), p.417.
26. Y. Xiang, X. Chen, and J.J. Vlassak, "The mechanical properties of electroplated Cu thin films measured by means of the bulge test technique",  in Thin Films: Stresses and Mechanical Properties IX, edited by C.S. Ozkan et al. (Mater. Res. Soc. Sym. Proc. 695, Warrendale, PA, 2002), p.189.
27. G. Zhou, Y. Jin, Y. Xiang, and P. Zhang, "Experimental research on the structure evolvement of magnetorheological fluids under the influence of magnetic fields", J. Exp. Mech. 15 (2), 233-239 (2000).