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PHY: Liang, Feng

published: 2016-10-12 15:37:48       hits: 

name : Liang, Feng Sex: Male phone: 18381072509
email: fengliang@uestc.edu.cn office-address: Room 710, Building of School of Physical Electronics
PH.D  Supervisor: Yes Master Supervisor: Yes
major: Physics
research interst: Computational Electromagnetics and Its Applications, Antennas and Propagation
Biography: Dr. Feng Liang was born in Hubei Province, China, on November 1983. He received the B.S. degree in applied physics from the University of Electronic Science and Technology of China (UESTC), Chengdu, China, in 2006 and the Ph.D. degree in electrical engineering from Wuhan University, Wuhan, China, in 2011. Since July 2011, he has been a Faculty Member of the School of Physical Electronics, UESTC, where he was promoted as an associate professor in Radio Physics in August 2013. From March 2014 to March 2015 he worked as Post Doctoral Scholar at the Department of Electrical Engineering and Computer Science, University of Wisconsin-Milwaukee, Milwaukee, WI, USA. His current research interests include theory, computation, and applications of electromagnetic fields.
Education experience: From September 2006 to June 2011

Ph.D. degree in Electrical Engineering from Wuhan University, Wuhan, Hubei, China.

From Setember 2002 to July 2006

B.S. degree in Applied Physics from School of Physical Electronics, UESTC, Chengdu, Sichuan, China.
Selected Publications: Aobo Chen, Feng Liang(*), Bing-Zhong Wang, Wen-Sheng Zhao, and Gaofeng Wang, "Conduction mode analysis and impedance extraction of shielded pair transmission lines,"IEEE Microwave and Wireless Components Letters, vol. 26, no. 9, pp. 654-656, September 2016.

Wen-Sheng Zhao, Jie Zheng, Linxi Dong, Feng Liang, Yue hu, Luwen Wang, Gaofeng Wang(*), and Qifa zhou, "High frequency modeling of on-chip coupled carbon nanotube interconnects for millimeter-wave applications", IEEE Transactions on Componennts, Packaging and Manufacturing Technology, vol. 6, no. 8, pp.1226-1232, August 2016.

Wen-Sheng Zhao, Jie Zheng, Feng Liang, Kuiwen Xu, Xi Chen, and Gaofeng Wang(*), “Wideband modeling and characterization of differential through-silicon vias for 3-D ICs,” IEEE Transactions on Electron Devices, vol. 63, no. 3, pp. 1168-1175, March 2016.

Feng Liang, George W. Hanson(*), Alexander B. Yakovlev, Giampiero Lovat, Paolo Burghignoli, Rodolfo Araneo, and Seyyed A. Hassani Gangaraj, “Dyadic Green'sfunctions for dipole excitation of homogenized metasurfaces,” IEEE Transactions on Antennas and Propagation, vol. 64, no. 4, pp. 167-178, January 2016.

Aobo Chen, Feng Liang(*), Gaofeng Wang, and Bing-Zhong Wang, "Closed-form impedance model for annular through-silicon via pairs in three-dimensional integration,"IET Microwave Antennas & Propagation, vol. 9, no. 8, pp. 808-813, June 2015.

Feng Liang(*), Alexander B. Yakovlev, and George W. Hanson, "Optimum surface plasmon excitation and propagation on conductive two-dimensional materials and thin films," IEEE Transactions on Antennas and Propagation, vol. 63, no. 4, pp. 1765-1774, April 2015.
Books: No